학술논문
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A CMP Process for Hybrid Bonding Application with Conventional / nt-Cu and SixNy / SixOy Dielectrics
Conference
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2058-2061 May, 2024
Conference
Deb, N.; Tomita, Y.; Brun, X. F.; Masuyama, C.; Hirano, Y.; Hamada, N.; Wada, K.; Oshida, H.; Ganbayashi, K.
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :29-33 May, 2023
300mm Full Thickness Si-Based IC Singulation Using Plasma Dicing for Advanced Packaging Technologies
Conference
Surapaneni, R.; Hamlin, B. S.; Chiu, J.; Brun, X. F.; Barnett, R.; Muggeridge, M.; Bhasker, H.; Richards, N.
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1019-1024 May, 2022
Conference
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1271-1276 May, 2022
Conference
Deb, N.; Brun, X. F.; Masuyama, C.; Hamada, N.; Hirano, Y.; Wada, K.; Oshida, H.; Ganbayashi, K.; Zhou, L. L.; Lu, T. Y.
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :43-49 May, 2022
Conference
Arata, Shogo; Noda, Chiaki; Ichige, Yasuhiro; Nomura, Satoyuki; Widodo, T. S.; Tsunoda, N.; Brun, X. F.
2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :87-89 Jun, 2022
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[AR] Brun, X. F.
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