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à á Á é É í Í Ó ó Ú ú Ñ ñ ä Ä
Α Β Γ Δ Ε Ζ Η Θ Ι Κ Λ Μ  
Ν Ξ Ο Π Ρ Σ Τ Υ Φ Χ Ψ Ω  
α β γ δ ε ζ η θ ι κ λ μ  
ν ξ ο π ρ ς σ τ υ φ χ ψ ω
À Á Â Ã Ä Å Æ Ç È É Ê Ë Ì Í Î Ï
Ð Ñ Ò Ó Ô Õ Ö Ø Ù Ú Û Ü Ý Þ ß  
à á â ã ä å æ ç è é ê ë ì í î ï
ð ñ ò ó ô õ ö ø ù ú û ü ý þ ÿ  
А Б В Г Д Е Ё Ж З И Й К Л М Н О П
Р С Т У Ф Х Ц Ч Ш Щ Ъ Ы Ь Э Ю Я  
а б в г д е ё ж з и й к л м н о п
р с т у ф х ц ч ш щ ъ ы ь э ю я  
ⅰ ⅱ ⅲ ⅳ ⅴ ⅵ ⅶ ⅷ ⅸ ⅹ Ⅰ Ⅱ Ⅲ Ⅳ Ⅴ Ⅵ Ⅶ Ⅷ Ⅸ Ⅹ
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± × ÷ ≠ ≤ ≥ ∞ ∴ ∠ ⊥ ⌒ ∂ ∇ ≡ ≒
≪ ≫ √ ∽ ∝ ∵ ∫ ∬ ∈ ∋ ⊆ ⊇ ⊂ ⊃ ∪ ∩ ∧
∨ ￢ ⇒ ⇔ ∀ ∃ ∮ ∑ ∏ ＋ － ＜ ＝ ＞      
  ก ข ฃ ค ฅ ฆ ง จ ฉ ช ซ ฌ ญ ฎ ฏ
ฐ ฑ ฒ ณ ด ต ถ ท ธ น บ ป ผ ฝ พ ฟ
ภ ม ย ร ฤ ล ฦ ว ศ ษ ส ห ฬ อ ฮ ฯ
ะ ั า ำ ิ ี ึ ื ุ ู ฺ         ฿
เ แ โ ใ ไ ๅ ๆ ็ ่ ้ ๊ ๋ ์ ํ ๎ ๏
᠀ ᠁ ᠂ ᠃ ᠄ ᠅ ᠆ ᠇ ᠈ ᠉ ᠊          
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ᡀ ᡁ ᡂ ᡃ ᡄ ᡅ ᡆ ᡇ ᡈ ᡉ ᡊ ᡋ ᡌ ᡍ ᡎ ᡏ
소장자료(Catalog)
15
더보기
Electroless Ni-P피막을 전극으로한 ZnO바리스터의 전기적 특성
김성진
서울 : 광운대학, 1987.
나노생명과학도서관
대출가능
Electroless plating :fundamentals and applications
Mallory, Glenn O
Orlando: American Electroplaters and Surface Finishers Society, 2009, [1990]
중앙도서관
대출가능
Electroless nickel plating[electronic resource] : fundamentals to applications
Delaunois, Fabienne
Florida : CRC Press, Taylor & Francis Group, [2020]
중앙도서관
전자자료게시
Effects of Transport and Additives on Electroless Copper Plating
Zeszut, Ronald
[S.l.] : Case Western Reserve University, 2017
중앙도서관
전자자료게시
無電解 Ni 複合鍍金 과정에서 粉末의 共析 機構에 대한 硏究 = (A)study on the codeposition mechanism of suspended particles in electroless 'Ni composite coatings
이승평
서울 : 漢陽大學校, 1990.
나노생명과학도서관
대출가능
학술논문(e-Article)
66,164
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Growth of Nanovoids in Electroless Cu Layer of Micro-Via After Thermal Reliability Test
by Nishijima, Masahiko; Hsieh, Ming-Chun; Zhang, Zheng; Suetake, Aiji; Okumura, Rieko; Yoshida, Hiroyoshi; Chen, Chuantong; Seto, Hiroki; Kitahara, Yuhei; Hashizume, Kei; Yamanaka, Kimihiro; Suganuma, Katsuaki
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2025 IEEE 75th. :1055-1060 May, 2025
Full Text (IEEE) Find it@PNU
Characterization of Electroless Palladium Precipitates Induced by Water-Ligand Interactions
by Min, Chew Yen; Wai, Wan Tatt; Ni, Cheong Yan; Choe Peng, Leo
2025 36th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2025 36th Annual. :1-6 May, 2025
Full Text (IEEE) Find it@PNU
Evaluating the Adhesive Properties of Electroless Cu on Glass-Reinforced Epoxy-Based Build-Up Dielectric Films via Nanoindentation
by Kang, Y.; Park, W.; Yoo, D.; Won, K.; Lee, S.; Kim, J.; Kim, Y.; Lee, D.
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 15(6):1344-1350 Jun, 2025
Full Text (IEEE) Web of Science JCR 저널정보 Scopus Find it@PNU
Pretreatments for Electroless Silver Plating of D-Band Plastic Rectangular Waveguides
by Quint, Alexander; Hochberg, Fabian; Eckl, Maximilian; Frolich, Andreas; Zwick, Thomas; Bhutani, Akanksha
2025 16th German Microwave Conference (GeMiC) German Microwave Conference (GeMiC), 2025 16th. :522-525 Mar, 2025
Full Text (IEEE) Find it@PNU
Bonding and Failure Mechanisms of Sintered-Silver Die-Attach on Electroless Nickel (Phosphorus) Surface Finish for Packaging Power Electronics Modules
by Wang, M.; Zhang, H.; Hu, W.; Mei, Y.; Lu, G.
IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 40(9):13086-13098 Sep, 2025
Full Text (IEEE) Web of Science JCR 저널정보 Scopus Find it@PNU
전자저널(e-Journal)
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전자책(e-Book)
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