'학술논문' 에서의 검색결과 18건 | 목록 1~10
-
1. ARTICLEAn open challenge to advance probabilistic forecasting for dengue epidemics
- In: Proceedings of the National Academy of Sciences of the United States of America. (Proceedings of the National Academy of Sciences of the United States of America, 26 November 2019, 116(48):24268-24274)
-
2. ARTICLEErratum: An open challenge to advance probabilistic forecasting for dengue epidemics (Proceedings of the National Academy of Sciences of the United States of America (2019) DOI: 10.1073/pnas.1909865116)
- In: Proceedings of the National Academy of Sciences of the United States of America. (Proceedings of the National Academy of Sciences of the United States of America, 17 December 2019, 116(51):26087-26088)
-
3. ARTICLEErrors associated with outpatient computerized prescribing systems
- In: Journal of the American Medical Informatics Association. (Journal of the American Medical Informatics Association, 2011, 18(6):767-773)
-
4. ARTICLEVaginal Ultrasound-Directed Myolysis: Preclinical Testing on Fibroids after Hysterectomy
- In Abstracts of the 43rd AAGL Global Congress of Minimally Invasive Gynecology, The Journal of Minimally Invasive Gynecology November-December 2014 21(6) Supplement:S91-S91
-
5. ARTICLEKinetic Monte Carlo simulation of strained heteroepitaxial growth with intermixing
- In: Continuum Mechanics and Thermodynamics. (Continuum Mechanics and Thermodynamics, January 2010, 22(1):1-26)
-
6. ARTICLELevel-set simulation for the strain-driven sharpening of the island-size distribution during submonolayer heteroepitaxial growth
- In: Physical Review B - Condensed Matter and Materials Physics. (Physical Review B - Condensed Matter and Materials Physics, 8 October 2009, 80(15))
-
7. CONFERENCESolder metallization interdiffusion in microelectronic interconnects
- 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th. :451-457 1999
-
8. ARTICLESolder metallization interdiffusion in microelectronic interconnects
- IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 23(2):383-387 Jun, 2000
-
9. ARTICLESolder metallization interdiffusion in microelectronic interconnects
- In: IEEE Transactions on Components and Packaging Technologies. (IEEE Transactions on Components and Packaging Technologies, 2000, 23(2):383-387)
-
10. ARTICLESputum Gram stain assessment in community-acquired bacteremic pneumonia
- In: Journal of Clinical Microbiology. (Journal of Clinical Microbiology, 1988, 26(5):846-849)