학술논문
'학술논문'
에서 검색결과 553건 | 목록
1~10
Conference
Manessis, D.; Seckel, M.; Fu, L.; Tsilipakos, O.; Pitilakis, A.; Tasolamprou, A.; Kossifos, K.; Varnava, G.; Liaskos, C.; Kafesaki, M.; Soukoulis, C. M.; Tretyakov, S.; Georgiou, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K-D.
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-7 Sep, 2020
Conference
Braun, T.; Kahle, R.; Voges, S.; Holck, O.; Bauer, J.; Becker, K.-F.; Aschenbrenner, R.; Dreissigacker, M.; Schneider-Ramelow, Martin; Lang, K.-D.
2019 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2019 International. :1-6 Oct, 2019
Conference
Manessis, D.; Schischke, K.; Pawlikowski, J.; Krivec, T.; Schulz, G.; Podhradsky, G.; Aschenbrenner, R.; Schneider-Ramelow, M.; Ostmann, A.; Lang, K-D.
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-8 Sep, 2019
Conference
Manessis, D.; Seckel, M.; Fu, L.; Tsilipakos, O.; Pitilakis, A.; Tasolamprou, A.; Kossifos, K.; Varnava, G.; Liaskos, C.; Kafesaki, M.; Soukoulis, C. M.; Tretyakov, S.; Georgiou, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K-D.
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-7 Sep, 2019
Conference
Braun, Tanja; Becker, Karl-Friedrich; Hoelck, Ole; Voges, Steve; Kahle, Ruben; Graap, Pascal; Wohrmann, Markus; Aschenbrenner, R.; Dreissigacker, Marc; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :861-867 May, 2019
Conference
Braun, Tanja; Billaud, Mathilde; Zedel, Hannes; Stobbe, Lutz; Becker, Karl-Friedrich; Hoelck, Ole; Wohrmann, Markus; Boettcher, Lars; Topper, Michael; Aschenbrenner, R.; Voges, Steve; Lang, Klaus-Dieter; Schneider-Ramelow, Martin
2018 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2018 International. :1-7 Oct, 2018
Conference
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Wohrmann, M.; Boettcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :70-78 May, 2018
Conference
Braun, T.; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :247-251 Apr, 2018
Conference
Braun, T.; Becker, K.-F.; Hoelck, O.; Voges, S.; Boettcher, L.; Topper, M.; Stobbe, L.; Aschenbrenner, R.; Voitel, M.; Schneider-Ramelow, M.; Lang, K.-D.
2019 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2019 IEEE. :85-87 Nov, 2019
Conference
2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2018 IEEE 2nd. :223-226 Mar, 2018
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제한된 항목
[AR] Aschenbrenner, R.
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