학술논문
An Alternative Post-bond Testing Method for TSVs
Document Type
Conference
Source
2020 9th International Conference on Modern Circuits and Systems Technologies (MOCAST) Modern Circuits and Systems Technologies (MOCAST), 2020 9th International Conference on. :1-4 Sep, 2020
Subject
Language
Abstract
Through Silicon Vias (TSVs) are crucial elements for the reliable operation and the yield of three-dimensional integrated circuits (3D ICs). Defects are a serious concern in TSV structures. An improvement of a post bond testing method for TSVs that is based on half Schmitt trigger structures instead of unbalanced inverters is proposed in this work. This method is also used for the detection of short defects, in addition to resistive open ones. Extensive typical model simulations and Monte-Carlo analysis results, using the 65nm technology of TSMC, prove the effectiveness of the proposed improved scheme, which is performing better in terms of robustness and tolerance.