학술논문
Influence of geometric pattern design and surface roughness on thermal performance of copper to copper bonding
Document Type
Conference
Author
Source
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :73-73 May, 2017
Subject
Language
Abstract
This paper functions as a feasibility study to prove increase of thermal performance of patterned Cu with an analytic model that takes into account the surface roughness. The thermal resistance is described as a function of the bonded surface area.