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발행년	- (예 : 2010-2015)

Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Academic Journal

Golim, Obert; Vuorinen, Vesa; Wernicke, Tobias; Pawlak, Marta; Paulasto-Kröckel, Mervi

In Microelectronic Engineering 1 March 2024 286

Full Text (ScienceDirect 종량제) Web of Science JCR 저널정보 Scopus Find it@PNU

0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer

Conference

Ma, Kai; Bekiaris, Nikolaos; Hsu, Ching-Hsiang; Xue, Lei; Ramaswami, Sesh; Ding, Taotao; Probst, Gernot; Wernicke, Tobias; Uhrmann, Thomas; Wimplinger, Markus

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :331-336 May, 2024

Full Text (IEEE) Find it@PNU

Investigation on the use of Al-Ge eutectic bonding in the structure part of a multilayer stacked MEMS device

Conference

Wang, Jun; Mannarino, Manuel; Visker, Jakob; Kang, Shuo; Weidlinger, Gunther; Wernicke, Tobias; Burggraf, Jurgen; Wimplinger, Markus; Majeed, Bivragh; Peng, Lan; Karve, Gauri; Haspeslagh, Luc

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2008-2012 May, 2024

Full Text (IEEE) Find it@PNU

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Academic Journal

Golim, Obert; Vuorinen, Vesa; Ross, Glenn; Wernicke, Tobias; Pawlak, Marta; Tiwary, Nikhilendu; Paulasto-Kröckel, Mervi

In Scripta Materialia 1 January 2023 222

Full Text (ScienceDirect) Web of Science JCR 저널정보 Scopus Find it@PNU

Low temperature formation of CuIn1 − xGaxSe2 solar cell absorbers by all printed multiple species nanoparticulate Se + Cu–In + Cu–Ga precursors

Academic Journal

Möckel, Stefan A.; Wernicke, Tobias; Arzig, Matthias; Köder, Philipp; Brandl, Marco; Ahmad, Rameez; Distaso, Monica; Peukert, Wolfgang; Hock, Rainer; Wellmann, Peter J.

In Thin Solid Films 1 May 2015 582:60-68

Full Text (ScienceDirect) Web of Science JCR 저널정보 Scopus Find it@PNU

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Conference

Hotchkiss, Joseph; Vuorinen, Vesa; Dong, Hongqun; Ross, Glenn; Kaaos, Jani; Paulasto-Krockel, Mervi; Wernicke, Tobias; Ponninger, Anneliese

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-5 Sep, 2020

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Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding.

Academic Journal

Vuorinen, Vesa; Ross, Glenn; Klami, Anton; Dong, Hongqun; Paulasto-Krockel, Mervi; Wernicke, Tobias; Ponninger, Anneliese

IEEE Transactions on Components, Packaging & Manufacturing Technology. Mar2022, Vol. 12 Issue 3, p446-453. 8p.

Full Text (IEEE) Web of Science JCR 저널정보 Scopus Find it@PNU

Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration.

Periodical

Wernicke, Tobias; Rebhan, Bernhard; Vuorinen, Vesa; Paulasto-Krockel, Mervi; Dubey, Vikas; Diex, Kevin; Wünsch, Dirk; Baum, Mario; Wiemer, Maik; Tanaka, Shuji; Froemel, Joerg; Aasmundtveit, Knut E.; Nguyen, Hoang V.; Dragoi, Viorel

ECS Meeting Abstracts; 2023, Vol. MA2023-02 Issue 1, p1619-1619, 1p

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Low temperature formation of CuIn1-xGaxSe2 solar cell absorbers by all printed multiple species nanoparticulate Se plus Cu-In plus Cu-Ga precursors

Academic Journal

Moeckel, Stefan A.; Wernicke, Tobias; Arzig, Matthias; Koeder, Philipp; Brandl, Marco; Ahmad, Rameez; Distaso, Monica; Peukert, Wolfgang; Hock, Rainer; Wellmann, Peter J.

THIN SOLID FILMS; MAY 1 2015, 582 p60-p68, 9p.

Full Text (ScienceDirect) Web of Science JCR 저널정보 Scopus Find it@PNU

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