학술논문
'학술논문'
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1~10
Conference
Vial, K.; Jouve, A.; Rolland, E.; Coudrain, P.; Aumont, C.; Foumel, F.; Pellat, M.; Montmeat, P.; Allouti, N.; Eleouet, R.; Argoud, M.; Dechamp, J.; Bally, L.; Vignoud, L.; Hida, R.; Ratin, C.; Magis, T.; Loup, V.; Kachtouli, R.; Gabette, L.; Mourier, T.; Laviron, C.; Cheramy, S.; Sillon, N.
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :445-450 Dec, 2012
Conference
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :25-25 May, 2017
Conference
2015 IEEE 12th International Conference on Group IV Photonics (GFP) Group IV Photonics (GFP), 2015 IEEE 12th International Conference on. :61-62 Aug, 2015
Academic Journal
Katsaros, G.; Golovach, V. N.; Spathis, P.; Ares, N.; Stoffel, M.; Foumel, F.; Schmidt, O. G.; Glazman, L. I.; De Franceschi, S.
Conference
In: ECS Transactions . (ECS Transactions, 2018, 86(5):49-53)
Conference
In: ECS Transactions . (ECS Transactions, 2018, 86(5):223-231)
Conference
In: ECS Transactions , Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gosele. (ECS Transactions, 2010, 33(4):495-500)
Conference
In: ECS Transactions , ECS Transactions - Semiconductor Wafer Bonding 10: Science, Technology, and Applications. (ECS Transactions, 2009, 16(8):475-488)
Conference
Andrieu, F.; Ernst, T.; Faynot, F.O.; Hartmann, J.-M.; Eymery, J.; Lafond, D.; Dupré, C.; Foumel, F.; Fenosillet-Beranger, C.; Kemevez, N.; Deleonibus; Ghibaudo, G.; Bogumilowicz, Y.; Levaillant, Y.-M.; Ghyselen, B.; Mazure, C.; Powers, R.; Vandooren, A.
In: Proceedings - IEEE International SOI Conference , 2005 IEEE International SOI Conference - Proceedings. (Proceedings - IEEE International SOI Conference, 2005, 2005:223-224)
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제한된 항목
[AR] Foumel, F.
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