학술논문
Correlation of polishing pad property and pad debris on scratch formation during CMP
Document Type
Conference Paper
Source
In: ICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings , ICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings. (ICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings, 2012, :391-396)
Subject
Language
English