학술논문
Additional stresses of ECA joints due to moisture induced swelling
Document Type
Conference Paper
Author
Source
In: 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007 , 16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007. (16th European Microelectronics and Packaging Conference and Exhibition 2007, EMPC 2007, 2007, :221-226)
Subject
Language
English