학술논문
Experimental three-dimensional thermal mapping of a GaN on RF-SOI chip
Document Type
Conference Paper
Author
Source
In: THERMINIC 2022 - 28th International Workshop on Thermal Investigations of ICs and Systems, Proceedings , THERMINIC 2022 - 28th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. (THERMINIC 2022 - 28th International Workshop on Thermal Investigations of ICs and Systems, Proceedings, 2022)
Subject
Language
English