학술논문
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10μm pitch microbumps
Document Type
Conference Paper
Author
Source
In: Proceedings - Electronic Components and Technology Conference , Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. (Proceedings - Electronic Components and Technology Conference, 2021, 2021-June:1119-1124)
Subject
Language
English
ISSN
05695503