학술논문
3D-Printed Optics for Wafer-Scale Probing
Document Type
Conference
Author
Source
2018 European Conference on Optical Communication (ECOC) Optical Communication (ECOC), 2018 European Conference on. :1-3 Sep, 2018
Subject
Language
Abstract
Mass production of photonic integrated circuits requires high-throughput wafer-level testing. We demonstrate that optical probes equipped with 3D-printed elements allow for efficient coupling of light to etched facets of nanophotonic waveguides. The technique is widely applicable to different integration platforms.