학술논문

Characteristics of transistors fabricated on silicon-on-quartz prepared using a mechanically initiated exfoliation technique
Document Type
Periodical
Source
IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 26(9):607-609 Sep, 2005
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Wafer bonding
Plasma temperature
MOSFETs
Silicon
Electron mobility
Tensile strain
Substrates
Conductivity
FETs
Semiconductor thin films
Ion-cutting
mobility enhancement
silicon-on-quartz (SOQ)
strained-silicon
Language
ISSN
0741-3106
1558-0563
Abstract
Single-crystalline silicon thin film on fused quartz (SOQ) was prepared using a technique based on wafer bonding and mechanically initiated exfoliation. MOSFETs fabricated on the resulting SOQ were characterized. The measured low-field electron effective mobility was /spl sim/1072 cm/sup 2//V/spl middot/s, which is /spl sim/35% higher than that extracted from reported "universal curve" for electron effective mobility. Consistent with the mobility enhancement, a tensile strain of 0.25% in the SOQ was deduced from Raman spectroscopy. At /spl sim/243 cm/sup 2//V/spl middot/s, no enhancement in hole effective mobility was observed.