학술논문

Ultrasonic study of the bonding quality symmetry of a three-layer bonded structure
Document Type
Conference
Source
2023 7th IEEE Congress on Information Science and Technology (CiSt) Information Science and Technology (CiSt), 2023 7th IEEE Congress on. :400-404 Dec, 2023
Subject
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineering Profession
General Topics for Engineers
Robotics and Control Systems
Signal Processing and Analysis
Transportation
Ultrasonic imaging
Aluminum
Acoustics
Reflection coefficient
Rigidity
Behavioral sciences
Bonding
Ultrasonics
Non-destructive testing
Normal rigidity
Quality
Symmetry-bonding
Language
ISSN
2327-1884
Abstract
The quality control of bonded structures is very important and decisive in the industry, especially in the aeronautics and automotive industries. a non-destructive method is proposed to evaluate the bonding quality for a threelayer structure such as Plexiglas/Adhesive/Aluminum by using ultrasound. The transmission of tensile and shear stresses through the interfaces of the adhesive layer is different. Indeed, the external stresses on the Aluminum and Plexiglas sheets are generally different. In addition, the high thermal loads on the two sides of the bonded structure are also different. Therefore, the evolution of the bonding forces across the two adherent/adhesive joints is not necessarily symmetrical. In this work, the study of the symmetry of the bonding quality across the joints of the structure has been carried out. The analysis of the behavior of the reflection coefficient of this structure subjected to a beam of ultrasound, alweaked to distinguish the different qualities of bonding (perfect, medium or weak) of the two joints of the structure. This work allowed determining the effective criteria to evaluate the normal rigidities through the bonding joints. These criteria are based on the depths of the resonant modes of the plates forming the structure. The results of the simulations performed on the quality control of the bonding interfaces allow the evaluation of the normal rigidities at the joints.