학술논문
Enhanced process control of pitch split double patterning by use of CD-SEM critical dimension uniformity and local overlay metrics
Document Type
Conference
Author
Source
2012 SEMI Advanced Semiconductor Manufacturing Conference Advanced Semiconductor Manufacturing Conference (ASMC), 2012 23rd Annual SEMI. :321-326 May, 2012
Subject
Language
ISSN
1078-8743
2376-6697
2376-6697
Abstract
A Critical Dimension-Scanning Electron Microscopy (CD-SEM) technique for determination of both the CD width and the local overlay between individual pitch split layer 1 and layer 2 is employed for measurement on electrical device test structures and nearby in-die metrology sites. Measured overlay correlation studies by varying radial distances of in-die overlay metrology sites to the electrical test structures within the field show distance threshold effects. The lack of overlay vector correlation above a distance threshold is confirmed by examining the correlation of the electrically measured capacitance difference between the pitch split layers and the measured overlay at different in-die site locations. This methodology is applied to examine pitch split process improvements.