학술논문
Intermetallic Compounds as Alternatives to Copper for Advanced Interconnect Metallization
Document Type
Conference
Author
Source
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023
Subject
Language
ISSN
2380-6338
Abstract
Recently, the search for alternative metallization schemes beyond Cu has been extended from elemental metals to binary and ternary intermetallics. Here, we review our material selection process for binary intermetallic compounds and discuss the additional complexities to understand the transport in such metals with respect to elemental metals. A simple but practical resistance model for binary compounds is proposed by extending the Mayadas-Shatzkes model for ordered intermetallics.