학술논문
A modified microstrip to empty substrate integrated waveguide transition.
Document Type
Article
Source
Subject
*SUBSTRATE integrated waveguides
*MICROSTRIP transmission lines
*IMPEDANCE matching
*INSERTION loss (Telecommunication)
*
*
*
Language
ISSN
1096-4290
Abstract
In this article, a new design of a microstrip to empty substrate integrated waveguide with reduced fabrication complexity is presented. A tapered microstrip section is used for mode and impedance matching. The guiding medium below the transition area is air. The proposed design is validated both in X and K‐band. Finally, a prototype of such back‐to‐back transition is fabricated for X‐band operation. The measured results show that the insertion loss of the back‐to‐back transition is less than 1 dB with return loss better than 15 dB over 7.2–11.2 GHz, whereas the return loss is better than 10 dB over the entire X‐band. The leakage from the transitions is also studied. [ABSTRACT FROM AUTHOR]