소장자료
| LDR | 01667cam a2200000 a | ||
| 001 | 0100536181▲ | ||
| 005 | 20211229105411▲ | ||
| 007 | ta ▲ | ||
| 008 | 200626s2021 flu b 001 0 eng c▲ | ||
| 010 | ▼a 2020028727▲ | ||
| 020 | ▼a9781138624733 (hbk.)▲ | ||
| 020 | ▼a9780367635886 (pbk.)▲ | ||
| 020 | ▼z9780429460470 (ebk.)▲ | ||
| 035 | ▼a(KERIS)REF000019331813▲ | ||
| 040 | ▼aDLC▼beng▼cDLC▼d221016▲ | ||
| 050 | 0 | 0 | ▼aTK7874.53▼b.S84 2020▲ |
| 082 | 0 | 4 | ▼a621.3815▼223▲ |
| 090 | ▼a621.3815▼bS947a▲ | ||
| 100 | 1 | ▼aSuhir, Ephraim.▲ | |
| 245 | 1 | 0 | ▼aAvoiding inelastic strains in solder joint interconnections of IC devices /▼cauthored by: Ephraim Suhir.▲ |
| 260 | ▼aBoca Raton, FL :▼bCRC Press,▼c2021.▲ | ||
| 300 | ▼axiii, 382 p. ;▼c24 cm.▲ | ||
| 504 | ▼aIncludes bibliographical references and index.▲ | ||
| 520 | ▼a"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"-- Provided by publisher.▲ | ||
| 650 | 0 | ▼aInterconnects (Integrated circuit technology)▼xProtection.▲ | |
| 650 | 0 | ▼aSolder and soldering▼xMechanical properties▼xMathematical models.▲ | |
| 650 | 0 | ▼aFailure analysis (Engineering)▲ |
Avoiding inelastic strains in solder joint interconnections of IC devices
자료유형
국외단행본
서명/책임사항
Avoiding inelastic strains in solder joint interconnections of IC devices / authored by: Ephraim Suhir.
개인저자
발행사항
Boca Raton, FL : CRC Press , 2021.
형태사항
xiii, 382 p. ; 24 cm.
서지주기
Includes bibliographical references and index.
요약주기
"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"-- Provided by publisher.
주제
ISBN
9781138624733 (hbk.) 9780367635886 (pbk.)
청구기호
621.3815 S947a
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