학술논문
'학술논문'
에서 검색결과 56건 | 목록
1~10
Conference
Wu, Y.; Cai, F.; Thomas, L.; Liu, T.; Nourbakhsh, A.; Hebding, J.; Smith, E.; Quon, R.; Smith, R.; Kumar, A.; Pang, A.; Holt, J.; Someshwar, R.; Nardi, F.; Anthis, J.; Yen, S-H.; Chevallier, C.; Uppala, A.; Chen, X.; Breil, N.; Sherwood, T.; Wong, K.; Cho, W.; Thompson, D.; Hsu, J.; Ayyagari, B.; Krishnan, S.; Lu, Wei. D.; Chudzik, M.
2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :18.4.1-18.4.4 Dec, 2022
Academic Journal
Augur, R.; Child, C.; Ahn, J.H.; Tang, T.J.; Clevenger, L.; Kioussis, D.; Masuda, H.; Srivastava, R.; Oda, Y.; Oguma, H.; Quon, R.; Kim, B.; Sheng, H.; Hirooka, S.; Gupta, R.; Thomas, A.; Singh, S.M.; Fang, Q.; Schiwon, R.; Hamieh, B.; Wornyo, E.; Allen, S.; Kaltalioglu, E.; Ribes, G.; Zhang, G.; Fryxell, T.; Ogino, A.; Shimada, E.; Aizawa, H.; Minda, H.; Kim, S.O.; Oki, T.; Fujii, K.; Pallachalil, M.; Takewaki, T.; Hu, C.K.; Sundlof, B.; Permana, D.; Bolom, T.; Engel, B.; Labelle, C.; Sapp, B.; Nogami, T.; Simon, A.; Shobha, H.; Gates, S.; Ryan, E.T.; Bonilla, G.; Daubenspeck, T.; Shaw, T.; Osborne, G.; Grill, A.; Edelstein, D.; Restaino, D.; Molis, S.; Spooner, T.; Ferreira, P.; Biery, G.; Sampson, R.
In Microelectronic Engineering April 2012 92:42-44
Conference
Penny, C.; Gates, S.; Peethala, B.; Lee, J.; Priyadarshini, D.; Nguyen, S.; McLaughlin, P.; Liniger, E.; Hu, C.-K.; Clevenger, L.; Hook, T.; Shobha, H.; Kerber, P.; Seshadri, I.; Chen, J.; Edelstein, D.; Quon, R.; Bonilla, G.; Paruchuri, V.; Huang, E.
2017 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2017 IEEE International. :1-4 May, 2017
Conference
Motoyama, K.; van der Straten, O.; Maniscalco, J.; Huang, H.; Kim, YB.; Choi, JK.; Lee, JH.; Hu, C.-K.; McLaughlin, P.; Standaert, T.; Quon, R.; Bonilla, G.
2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :40-42 Jun, 2018
Conference
Yang, C.-C.; Spooner, T.; McLaughlin, P.; Hu, C.K.; Huang, H.; Mignot, Y.; Ali, M.; Lian, G.; Quon, R.; Standaert, T.; Edelstein, D.
2017 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2017 IEEE International. :1-3 May, 2017
Conference
Briggs, B.D.; Ley, R.; Bencher, C.; Bozano, L.; Fernandez, J.; Khasgiwale, N.; Krishnan, S.; Quon, R.; Chuang, C.C.; Suo, P.; Bum Yong, A.C.; Lianto, P.
In: Proceedings - Electronic Components and Technology Conference , Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. (Proceedings - Electronic Components and Technology Conference, 2024, :571-575)
Conference
Bozano, L.; Quon, R.; Briggs, B.; Ley, R.; Pang, A.; Suo, P.; Lianto, P.; Yong, A.; Sundarrajan, A.; Fernandez, J.; Khasgiwale, N.; Chuang, C.C.; Chen, J.F.; Krishnan, S.; Chudzik, M.; Bencher, C.
In: Proceedings of SPIE - The International Society for Optical Engineering , Advances in Patterning Materials and Processes XLI. (Proceedings of SPIE - The International Society for Optical Engineering, 2024, 12957)
Conference
Yang, C.-C.; Spooner, T.; Wang, W.; Maniscalco, J.; McLaughlin, P.; Hu, C.K.; Liniger, E.; Standaert, T.; Canaperi, D.; Quon, R.; Huang, E.; Edelstein, D.
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :89-91 May, 2016
Academic Journal
In: Interdisciplinary Science Reviews . (Interdisciplinary Science Reviews, 2022, 47(2):129-146)
Conference
Hu, C.-K.; Kelly, J.; Huang, H.; Motoyama, K.; Shobha, H.; Ostrovski, Y.; Chen, J. H-C; Patlolla, R.; Peethala, B.; Adusumilli, P.; Spooner, T.; Quon, R.; Gignac, L. M.; Breslin, C.; Lian, G.; Ali, M.; Benedict, J.; Lin, X. S.; Smith, S.; Kamineni, V.; Zhang, X.; Mont, F.; Siddiqui, S.; Baumann, F.
2018 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2018 IEEE International. :4F.1-1-4F.1-6 Mar, 2018
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[AR] Quon, R.
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