학술논문
Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction
Document Type
Conference Paper
Source
In: IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019 , IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019. (IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019, October 2019)
Subject
Language
English