학술논문
Advanced Tape Expansion/Assembly Technology for FOWLP and Micro-LED Display
Document Type
Conference
Author
Source
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :210-213 Oct, 2018
Subject
Language
ISSN
2150-5942
Abstract
This paper describes advanced assembly technologies based on a new tape expansion technique with a selective UV irradiation method for the application of FOWLP (Fan-Out Wafer-Level Packaging) with millimeter-scale dies and micro-LED display with several tens of micrometer-scaled dielets. The assembly technologies allow us to uniformly expand expansion tapes in all direction and array the dies/dielets at the regular pitches desired for their products. We demonstrate the uniform expansion of an expansion tape with 3-mm-square Si dies and 50-μm-square Si dielets using selectively irradiated UV light through a photomask.